TPT Semi-Automatic Thermosonic Wire Bonder (HB10)
Location: SE1: 153E
The TPT HB10 Semi-Automatic Thermosonic Wire Bonder is a versatile, high-precision bonding solution designed for research and production environments. Engineered for flexibility, it supports ball, wedge, bump, and ribbon bonding with gold, aluminum, copper, and silver wire.
Manual: hb16-hb10_user_manual_-linux_v1_aug2025.pdf or link: https://scif.ucmerced.edu/sites/g/files/ufvvjh1611/f/page/documents/hb16...
Key Features:
Multi-Bonding Capability: Easily switch between wedge and ball bonding.
Wide Wire Support: Bonds wires from 15–75 µm and ribbons up to 250 µm.
Precision Control: Motorized Z-axis with manual X/Y movement, electronic wire clamp, and ball size control.
User-Friendly Interface: 6.5" touchscreen with storage for 100 bonding parameters.
Integrated Performance Tools: Built-in heater stage controller, automatic height setup, and USB backup.
Advanced Bonding: 63.3 kHz PLL-controlled transducer, programmable ultrasonic power (0–10 W), time, and force.
Accessories & Options:
Leica Ivesta 3 microscope with dual LED illuminator.
Adjustable heater stage (up to 250°C).
Bond starter kit (tools, gold and aluminium wires , probes, substrates).
Pull tester (0–30 g range).
Pick & place kit with vacuum pump and epoxy stamping unit.
Spot light targeting system with 25 µm laser dot precision.
Applications:
Ideal for microelectronics, semiconductor packaging, sensor assembly, and advanced R&D requiring reliable interconnects with maximum precision and flexibility.
