Wire Bonder

TPT Semi-Automatic Thermosonic Wire Bonder (HB10)

Thermosonic ultrasonic wire bonder for wedge, ball, and bump bonding of Au/Al wires. Provides precise control of force, ultrasonic power, temperature, and time for reliable microelectronic interconnections.

Location: SE1: 153E

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Wire Bonder — TPT HB10 / HB16 Ultrasonic Wire Bonder

The TPT HB10 / HB16 Wire Bonder is a manual/semi-automatic thermosonic bonding system designed for precise electrical interconnections using gold or aluminum wire and ribbon. It supports wedge bonding, ball bonding, and bump bonding for microelectronic device fabrication.

Key Features

  • Ultrasonic thermosonic bonding (force, ultrasonic power, time, temperature)
  • Supports wedge bonding, ball bonding, and ball bumping
  • Motorized Z-axis (and Y-axis in advanced models)
  • High-precision X–Y manual stage with microscope integration
  • TFT touch panel interface for parameter control and program management
  • Heater stage with temperature control (up to ~150°C typical for Au bonding)
  • Motorized wire spool and programmable bonding sequences

Bonding Principles

  • Uses ultrasonic Energy (~63 kHz) with applied force to create metal-to-metal bonds
  • Heat-assisted process improves bonding quality (thermosonic bonding)

Key parameters:

  • Ultrasonic power (primary driver of bond formation)
  • Force (ensures proper contact and pressure)
  • Time (controls diffusion and bonding quality)
  • Temperature (enhances bonding efficiency)

Operation Workflow

  • Load wire into motorized spool and thread through bonding tool
  • Install appropriate bonding tool (capillary or wedge)
  • Mount and secure sample on heated stage
  • Perform height setup and parameter configuration
  • Execute bonding sequence (automatic, semi-automatic, or manual mode)
  • Optimize parameters (US power, force, temperature, time) for reliability

Capabilities

  • Wire diameters: ~0.5–3 mil (Au/Al wire), ribbon bonding supported
  • Programmable multi-wire sequences (wire playlist)
  • Adjustable loop profiles and tailing modes
  • Suitable for research, prototyping, and small-scale production

Training and Usage

  • Users are trained on:
  • Wire loading and tool installation
  • Parameter setup and optimization
  • Bonding modes and sequence control
  • Troubleshooting bonding defects

The TPT HB10 Semi-Automatic Thermosonic Wire Bonder is a versatile, high-precision bonding solution designed for research and production environments. Engineered for flexibility, it supports ball, wedge, bump, and ribbon bonding with gold, aluminum, copper, and silver wire.

Manual: hb16-hb10_user_manual_-linux_v1_aug2025.pdf or link: https://scif.ucmerced.edu/sites/g/files/ufvvjh1611/f/page/documents/hb16...

Key Features:

Multi-Bonding Capability: Easily switch between wedge and ball bonding.

Wide Wire Support: Bonds wires from 15–75 µm and ribbons up to 250 µm.

Precision Control: Motorized Z-axis with manual X/Y movement, electronic wire clamp, and ball size control.

User-Friendly Interface: 6.5" touchscreen with storage for 100 bonding parameters.

Integrated Performance Tools: Built-in heater stage controller, automatic height setup, and USB backup.

Advanced Bonding: 63.3 kHz PLL-controlled transducer, programmable ultrasonic power (0–10 W), time, and force.

 

Accessories & Options:

Leica Ivesta 3 microscope with dual LED illuminator.

Adjustable heater stage (up to 250°C).

Bond starter kit (tools, gold and aluminium wires , probes, substrates).

Pull tester (0–30 g range).

Pick & place kit with vacuum pump and epoxy stamping unit.

Spot light targeting system with 25 µm laser dot precision.

 

Applications:
Ideal for microelectronics, semiconductor packaging, sensor assembly, and advanced R&D requiring reliable interconnects with maximum precision and flexibility.

Detailed Safety Considerations – Thermosonic Wire Bonder (TPT HB10 / HB16)

The thermosonic wire bonder involves hazards related to ultrasonic energy, heated surfaces, fine wire handling, mechanical motion, and precision tooling. While it is a relatively low-risk fabrication tool, improper operation can lead to burn injuries, equipment damage, wire/tool breakage, and sample damage. Only trained and authorized users may operate the system.

Thermal Hazards (Heated Stage and Tooling)

  • The bonding process uses elevated temperatures (typically up to ~150–250 °C).
  • Do not touch the heater stage, bonding tool, or nearby components during or immediately after operation
  • Allow sufficient cooling time before handling samples
  • Use tweezers or appropriate tools to handle substrates
  • Be aware that small components retain heat longer than expected

Ultrasonic Energy Hazards

  • The system uses high-frequency ultrasonic vibration (~63 kHz) during bonding.
  • Avoid contact with the bonding tool during ultrasonic operation
  • Do not place fingers near the bonding area during bonding cycles
  • Ensure correct parameter settings to avoid excessive vibration or tool damage
  • Stop operation immediately if abnormal noise or vibration occurs

Mechanical and Motion Hazards

  • The system includes motorized Z-axis movement and manual X–Y stage positioning.
  • Keep hands clear of bonding head during movement
  • Do not place fingers under the bonding tool or sample during operation
  • Ensure stable sample mounting before bonding
  • Avoid sudden movements that may cause tool collision or misalignment

Fine Wire and Tool Handling Safety

  • Bonding involves micron-scale wires and precision tools (capillary/wedge).
  • Handle wires (Au/Al) carefully to avoid breakage or injury
  • Do not touch bonding tool tips directly
  • Use proper tools for threading and loading wire
  • Ensure correct tool installation and alignment before operation
  • Dispose of broken wires properly to avoid contamination or injury

Laser Targeting System Safety 

  • Some systems include a laser spot targeting system (~25 µm precision).
  • Avoid direct eye exposure to laser beam
  • Do not look directly into the laser source
  • Use laser only for alignment as intended
  • Ensure proper system shielding and alignment

Electrical and System Safety

  • The system includes electronic controls, ultrasonic generator, and heater elements.
  • Do not open system panels or access internal electronics
  • Ensure proper grounding before operation
  • Avoid operation with damaged cables or exposed wiring
  • Report any electrical malfunction immediately

Sample Handling and Compatibility

  • Improper samples can lead to bonding failure or equipment damage.
  • Ensure samples are clean, flat, and securely mounted
  • Avoid contaminated or uneven surfaces
  • Verify compatibility of bonding materials (Au, Al, Cu, etc.)
  • Use appropriate substrate holders or fixtures

Process Parameter Safety

  • Incorrect bonding parameters can damage tools, wires, and samples.
  • Set ultrasonic power, force, time, and temperature within safe limits
  • Start with conservative parameters and optimize gradually
  • Avoid excessive force or power that may damage pads or tools
  • Monitor bonding quality and stop if irregularities occur

Contamination Control

  • Clean bonding conditions are critical for reliable interconnections.
  • Use only clean samples and bonding materials
  • Avoid introducing dust, तेल, or residues into bonding area
  • Clean stage and bonding area after use
  • Prevent cross-contamination between different materials

PPE Requirements

  • Lab garments (as required for the area)
  • Safety glasses (recommended, especially when handling wires)
  • Gloves when handling samples and materials

Operational Safety Checks (Pre-Run)

  • Sample is securely mounted and aligned
  • Bonding tool is correctly installed and undamaged
  • Wire is properly loaded and threaded
  • Heater stage temperature is set correctly
  • Bonding parameters (force, power, time) are verified
  • Stage and bonding area are clear of obstructions

Post-Operation Safety

  • Turn off ultrasonic power and heater
  • Allow stage and components to cool
  • Remove sample using appropriate tools
  • Inspect bonding tool and wire condition
  • Clean workspace and remove debris
  • Log system usage and report issues

Waste Handling and Contamination Control

  • Dispose of wire scraps and contaminated materials in designated containers
  • Do not leave loose wires or debris on stage
  • Maintain a clean bonding environment

Emergency Procedures

  • Tool crash or misalignment → stop system immediately
  • Excessive heat or burn risk → power down and allow cooling
  • Ultrasonic malfunction → stop operation and notify staff
  • Electrical issue → shut down system and report
  • Laser exposure concern → stop and secure system
  • Do not resume operation until the system has been inspected and cleared.

General Cleanroom Conduct

  • Use only approved materials and bonding procedures
  • Handle tools and wires with precision and care
  • Maintain cleanliness and alignment accuracy
  • Avoid unnecessary adjustments or force

Wire Bonder Training – Session Coverage

During the training session, the following topics and steps will be covered:

  • Overview of thermosonic wire bonding principles (wedge, ball, and bump bonding)

  • System components (bonding head, ultrasonic generator, heated stage, microscope, stage controls)

  • Cleanroom safety, thermal hazards, ultrasonic energy, and mechanical motion safety

  • Wire types and materials (Au, Al) and bonding tool selection (capillary, wedge)

  • Wire loading and threading procedures

  • Sample preparation and secure mounting on heated stage

  • Setting bonding parameters (ultrasonic power, force, time, temperature)

  • Bonding modes (manual, semi-automatic, programmable sequences)

  • Performing basic bonding operations and loop formation

  • Monitoring bond quality and consistency

  • Parameter optimization for reliable bonding

  • Common issues (weak bonds, non-stick, wire breakage) and basic troubleshooting

  • Safe shutdown, tool inspection, and system care

  • Cleanup, contamination control, and system readiness

Note: Training is conducted using standard samples and facility-available wires and tools, focusing on safe operation and understanding of bonding processes; users are responsible for carrying and advancing their own research projects.